Micron and TE Connectivity announced today the availability of a Single-Sided SODIMM and a low-profile single-sided, double data rate 3 (DDR3) SODIMM connector solution to take advantage of the market for Ultrabook devices, convertibles, tablets and other thin and light devices.
Aimed at providing a reduced-height memory solution for the ultrathin computing market, the new Single-Sided SODIMM, developed by Micron, has components on either the front or back side of the module, but not both. When paired with the single-sided DDR3 SODIMM connector from TE, the total z-height of the overall solution from the motherboard is just 3mm, a 35 percent savings compared to 4.6mm for a standard SODIMM solution.
Micron's Single-Sided SODIMM is available in a 4GB, single-rank, x8 configuration. In addition to a reduced height, this new module is built using 30nm DDR3L-RS components that consume less power in standby compared to standard DDR3. Additionally, Single-Sided SODIMMs are pin-to-pin compatible with current DDR3 modules, making them backward compatible with existing DDR3 SODIMM connectors.
TE engineers designed the new single-sided DDR3 SODIMM connector to deliver peak performance with high-speed data applications. The connector features a 35 percent reduction in height, compared with similar low-profile connectors, which in turn, reduces the height of the end-product by 5 to 10 percent. It also reduces motherboard shadow area by nearly 156 mm2, or 312 mm2 for common dual-socket implementation. The DDR3 SODIMM connector accepts modules that meet JEDEC MO268 industry standards and is offered in both standard and reverse types.
Single-Sided SODIMM as well as SODIMM connector samples are available from Micron and TE Connectivity now.
Micron will start mass production of the new memory in Spring, 2013, while SODIMM connector will be produced in June.
