Intel CTO Justin Rattner on December 4 said that Intel's development of 14nm technology is on schedule with volume production to kick off in one to two years and development of 18-inch wafers is under way through cooperation with partners.
Rattner also noted that Intel's aggressiveness over technology advancement will allow Moore's Law to extend for another 10 years.
At the end of 2013, Intel will enter the generation of 14nm CPUs (P1272) and SoCs (1273), while expanding its investments at its D1X Fab in Oregon, and Fab 42 in Arizona, the US and Fab 24 in Ireland, and will gradually enter 10nm, 7nm and 5nm process generations starting 2015.
As for Intel's competitors, Samsung is already set to enter 20nm in 2013 and is already working on its 14nm node, while Taiwan Semiconductor Manufacturing Company's (TSMC) 20nm process will enter small volume production in the second half of 2013 with the first 3D-based FPGA chips to also start.
Globalfoundries has previously announced its 14nm FinFET process will start pilot production at the end of 2013 and enter mass production in 2014.
As for 18-inch wafers, Intel has invested in Holland-based ASML for its EUV technology, and related technologies are expected to start entering production in 2017.
