Closely following Intel's news of its CULV platform, rival chipmaker AMD at Computex on Tuesday announced its dual-core Athlon Neo chip is now shipping to makers of ultra-thin and light notebooks. The dual-core Neo will be aimed at the same clients as Intel's CULV CPUs. All the specs for the dual-core CPU, which goes by the Conesus codename, are not yet known, however. What is known is that is sports 1MB of L2 cache, a DDR2 memory controller and more power-miserly 45nm construction.
Industry experts believe the dual-core chip should be somewhat quicker than the current single-core 1.6GHz Athlon Neo MV-40, which is based on an older 65nm architecture and sports 512KB of L2 cache.
Like the rival CULV chips from Intel, AMD's dual-core Neo will be available on a chipset with an upgraded integrated graphics processor, the Radeon 3200 with 512MB of memory through system RAM, which is a significant step up from the 128MB Radeon 1200 option found on current single-core Neos.
Source: electronista
